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Based on a high efficiency, ultra-compact and highly integrated PQFN package, the PQFN IPM uses PCB copper foil to dissipate heat and eliminates external heat sinks. It also provides a new benchmark that is comparable in size to any competing solution. It is mainly suitable for space-demanding applications such as hair dryers, with a power range of less than 100W.

PQFN8*9 IPM Features and Benefits:

• Other packaged modules are poor in terms of heat dissipation from the PCB, and the only way to dissipate power is through an external heat sink, but this adds cost and creates oscillations and other physical stresses;
• PQFN IPM current capability also depends on the PCB design, especially copper thickness, copper area and number of layers, and ultimately depends on the maximum allowable PCB temperature;
• Especially suitable for applications with small space and small area, replacing traditional low-power solutions, no need for radiators;
• Half bridge structure, more flexible application;